Loading...

Proceedings of

International Conference On Advances In Electronics, Electrical And Computer Science Engineering EEC 2012

"A TEST STRUCTURE FOR IN-SITU DETERMINATION OF RESIDUAL STRESS"

AKSHDEEP SHARMA DEEPAK BANSAL
DOI
10.15224/978-981-07-2950-9-9733
Pages
319 - 322
Authors
2
ISBN
978-981-07-2950-9

Abstract: “This work presents a lancet type residual stress measurement test structure which comprises of a pair of bent beams along with cantilevers as driving bars for the rotational pointer structure. The residual stress causes the bent beams to deflect each other, thereby magnifying the pointer deflection. The pointer deflection direction indicates the type of stress (compressive or tensile), with the displacement being independent of Young`s modulus and film thickness. Finite element modeling also used to analyze the structure and is compared with experimental results of electroplated Au structures.”

Keywords: MEMS, residual sess, test structure, FEM analysis

Download PDF